Toshiba Ends Cooperation with Chinese Wafer Maker
Toshiba has scrapped its power semiconductor cooperation with a Chinese wafer maker due to economic security considerations.
The decision to end the technology pact was made despite the fact that Toshiba's power semiconductor subsidiary will continue to source wafers from the Chinese company, SICC.
© Reuters
The move is seen as a response to economic security concerns, highlighting the complexities of international business deals in the tech industry.
Author's summary: Toshiba ends Chinese tech pact.
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